In the process of transition to intelligent manufacturing, traditional manufacturers allow devices to access the network by carrying a simple chip module, and then integrate the chip module into the original device. However, with the increase of users' demand for product functions and the arrival of the Internet of everything era, devices must meet multiple protocol standards at the same time to achieve interconnection, which requires a versatile multi-mode module to support different standards. 

The industry's leading supplier of semiconductor devices for market needs兆易创新GigaDevice，On October 17, 2023, GD32VW553 series dual-mode wireless microcontroller based on RISC-V core was officially launched. GD32VW553 series MCUS support Wi-Fi 6 and Bluetooth LE 5.2 wireless connectivity, with advanced RF integration, enhanced security mechanism, large capacity storage resources and rich general interface, combined with mature process platform and optimized cost control, to provide continuous solutions for market applications requiring efficient wireless transmission.

▲ GD32VW553 series RISC-V core dual-mode wireless MCU

✦领先的射频运算性能✦

For real-time processing and efficient communication needs, GD32VW553 series MCU adopts a new open source instruction set architecture RISC-V processor core, the main frequency can reach 160MHz, and is also equipped with advanced DSP hardware accelerator, double precision floating point unit (FPU) and instruction expansion interface and other resources. Excellent microarchitecture design achieves excellent energy efficiency and provides flexible scalability.

GD32VW553 series MCU integrated 2.4GHz Wi-Fi 6 RF module using IEEE 802.11ax standard and backward compatible with IEEE 802.11b/g/n standard, can be adapted to different network environments. It supports orthogonal frequency division multiple access (OFDMA), which enables multiple devices to share channel resources, and improves the data transmission rate by 60% compared with Wi-Fi 4. It also supports multi-user multi-input Multi-output (MU-MIMO), which can work with multiple devices at the same time without interfering with each other. In this way, high efficiency and low latency communication can be realized in the scenario of multi-device high density access.

The on-chip Bluetooth LE 5.2 RF module can extend communication distance, improve throughput, enhance security and save power with the latest Bluetooth specifications. Provides 2Mbps high-speed data mode and 125K/500Kbps multiple rates, effectively reducing transmission time and improving sensitivity. It can also help build and configure a stable and fast wireless network in many devices and complex environments.

The new dual-mode wireless MCU delivers advanced baseband and RF performance and includes a variety of additional features. Support for wireless coexistence protocols based on data transfer arbitration (PTA) mechanism, significantly reduce the same frequency interference generated by Wi-Fi and Bluetooth and improve the stability of signal reception. It also has high dynamic range automatic gain control (AGC), which effectively enhances signal quality. Thanks to Wi-Fi 6's timed Wake Up mechanism (TWT), the GD32VW553 flexibly schedules the sleep and wake up times of devices, effectively improving energy efficiency, and is suitable for low-power, long-life wireless device access needs.

✦High integration and security✦

The new GD32VW553 series integrates up to 4MB Flash and 320KB SRAM, with an additional 32KB of configurable instruction cache (I-Cache), greatly improving CPU processing efficiency. Not only has excellent wireless performance, the chip is also equipped with a wealth of universal wired interfaces, including 3 U(S)ART, 2 I2C, 1 SPI and 1 four-wire QSPI, and up to 29 programmable GPIO pins. Built-in 2 32-bit universal timers, 2 16-bit universal timers, 4 16-bit basic timers, 1 PWM advanced timer and 1 12-bit ADC. The power supply voltage is 1.8V~3.6V, and a wide temperature range of 85 ° C ~105 ° C is provided to meet the requirements of high temperature scenarios such as industrial control interconnection, lighting equipment and socket panels.

The GD32VW553 also features multiple security features to simplify secure connectivity and management of high-performance wireless devices. Support for Wi-Fi Protected Access (WPA) security features, including the new WPA3 encryption technology for personal and enterprise networks. Hardware encryption and decryption supports DES, triple DES, AES and Hash algorithms, and also supports public key encryption and decryption (PKCAU), so as to ensure the confidentiality and data integrity in the wireless communication process. True random number generators (TRNG) provide unpredictable data for key generation by multiple security protocols, further enhancing system security.

▲ GD32VW553 series MCU product portfolio

✦Enabling wireless innovation with ecology✦

GD32 covers the whole process of RISC-V development ecology has become increasingly perfect, and is highly compatible with the existing MCU development environment and usage habits, helping users quickly build competitive solutions. For the new GD32VW553 series of microcontrollers, Zhayi Innovation provides a free development environment GD32 IDE, debugging download tool GD-LINK and All-In-One programming tool GD32 all-in-One Programmer. It also simultaneously launched the SDK and supporting development board EVB that include functions such as underlying drivers, wireless protocol stacks, and application routines, and adapted a variety of real-time operating systems (RTOS) that support local, cloud connectivity, security, and over-the-air upgrade (OTA) functions to facilitate the rapid deployment of networked terminals. It complies with the Matter over Wi-Fi application standard developed by the International Organization Connectivity Standards Alliance (CSA) and supports the seamless interconnection of various Matter devices using GD32VW553, improving the compatibility and interoperability of smart home systems.

SEGGER, a leading provider of Embedded development systems in Germany, has entered into a strategic partnership with ZAG Innovation to provide developers with the SEGGER Embedded Studio integrated development environment (IDE) and a complete set of development tools for free commercial use. Sweden IAR will also provide full support for the new MCU GD32VW553, including the development of compilation and trace debugging tools.

The GD32VW553 series MCUS are officially Wi-Fi 6 certified by the Wi-Fi Alliance (WFA), Bluetooth certified by the Bluetooth SIG, and RF FCC/CE compliant. Zhaoeasy Innovation is cooperating with a number of module manufacturers and developer platforms to launch "turnkey solutions" such as wireless modules and service certification, helping embedded devices to quickly connect and application innovation, and quickly building Internet of Things platforms and product solutions that support a variety of wireless communications such as Wi-Fi and Bluetooth.